PCB Board Assembly Service Double-sided

Product Detail

PCB Assembly Sample Introduction

Product Details:

Place of Origin:	China
Brand Name:	OEM
Certification:	CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:	OEM

Payment & Shipping Terms:

Minimum Order Quantity:	1pcs
Price:	negotiation
Packaging Details:	inner: vacuum-packed bubble bag? outer: carton box
Delivery Time:	5-10 days
Payment Terms:	T/T,Western union
Supply Ability:	1, 000, 000 PCS / week

Detailed Product Description

Material:	FR4	Layer:	2
Color:	Green	Min Line Space:	10mil
Min Line Width:	10mil	Copper Thickness:	1OZ
Size:	5*4cm	Board THK:	1.0MM
Panel:	4*5	Surface Finish:	HASL
Model:	XCEA	Brand:	XCE

High Quality Electronics Products PCB / PCBA Assembly Service

NO	Item	Craft Capacity
1	Layer	1-30 Layers
2	Base Material for PCB	FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material
3	Rang of finish baords Thickness	0.21-7.0mm
4	Max size of finish board	900MM*900MM
5	Minimum Linewidth	3mil (0.075mm)
6	Minimum Line space	3mil (0.075mm)
7	Min space between pad to pad	3mil (0.075mm)
8	Minimum hole diameter	0.10 mm
9	Min bonding pad diameter	10mil
10	Max proportion of drilling hole and board thickness	1:12.5
11	Minimum linewidth of Idents	4mil
12	Min Height of Idents	25mil
13	Finishing Treatment	HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
14	Soldermask	Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
15	Minimun thickness of soldermask	10um
16	Color of silk-screen	White, Black, Yellow ect.
17	E-Testing	100% E-Testing (High Voltage Testing); Flying Probe Testing
18	Other test	ImpedanceTesting,Resistance Testing, Microsection etc.,
19	Date file format	GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20	Special technological requirement	Blind & Buried Vias and High Thickness copper
21	Thickness of Copper	0.5-14oz (18-490um)

Product type:

Single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of circuit boards, blind buried plate.

Max size: single-sided, double-sided: 1000mm * 600mm MLB: 600mm * 600mm

Highest Number of floors: 20 floors

Processing board thickness: 0.4mm -4.0mm rigid plate flexible plate 0.025mm --- 0.15mm

Copper foil substrate thickness: rigid plate 18µ (1 / 2OZ), 35µ (1OZ), 70µ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm

Common substrates: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly vinyl chloride, polyester, polyimide ammonium.

Process Capability:

(1) Drilling: Minimum aperture 0.15MM

(2) metal hole: Minimum aperture 0.15mm, thickness / aperture ratio of 4: 1

(3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate

(4) lead spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate

(5) gold plate: Ni layer thickness:> or = 2.5µ gold layer thickness: 0.05-0.1µm or according to customer requirements

(6) HASL: tin layer thickness:> or = 2.5-5µ

(7) paneling: Wire-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.2mm Minimum Shape tolerance: ± 0.12mm

(8) outlet chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm

(9) V cut: angle: 30 degrees, 35 degrees, 45 degrees Depth: 2/3 thickness minimum size: 80mm * 80mm

(10) off test:

Resistance to soldering heat: 85 --- 105 ? / 280 ? --- 360 ?

Flexible sheet resistance flexing resistance / chemical resistance: full compliance with international standards

Inspection:

1. The main inspection hole metallization quality status, should ensure that the hole was no extra burr, black holes, holes and so on;

2. Check the substrate surface dirt and other unwanted objects;

3. Check the board number, drawing number, process documentation and process description;

4. clarify racking parts, racking requirements and can withstand the plating tank plating area;

5. plating area, the process parameters to be clear, to ensure the stability and viability of the electroplating process parameters;

6. conductive parts cleaning and preparation, the solution was presented first energization process active;

7. finds bath composition is checked, plate surface area status; such as the use of spherical anode bar installed, you must also check the consumption;

8. Check the voltage solid case and the contact area, the current fluctuation range.